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Thermal analysis of high power LEDs using different PCB materials

2017-09Conference paper Restricted access
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dc.contributor.authorKyatam, Shusmitha
dc.contributor.authorCamacho, Pedro
dc.contributor.authorRodrigues, Luis
dc.contributor.authorAlves, Luis Nero
dc.contributor.authorMendes, Joana Catarina
dc.contributor.authorFigueiredo, Monica Carvalho
dc.date.accessioned2025-06-06T10:04:13Z
dc.date.available2025-06-06T10:04:13Z
dc.date.issued2017-09
dc.description.abstractVisible Light Communication is an emerging technology in Optical Wireless Communication where the Light Emitting Diodes (LEDs) are utilized for transmission of data. The luminance of the LEDs increases with the forward current; however, for high current levels the heat generated by nonradiative recombination of carriers increases the LED junction temperature, decreasing the efficiency and the lifetime of the devices. Therefore, the design of high power LED driver circuits needs to take into account the unavoidable local heating produced by high power components. In this paper, we performed thermal analysis of an LED driver mounted on Printed Circuit Boards (PCBs) using Thermal Risk Management (TRM) software and studied the heat dissipated by various components on PCBs composed of different dielectric materials such as FR4 and Diamond. Based on TRM simulations, the replacement of FR4 with diamond caused the junction temperature to decrease from 64°C to 45.2°C for a forward current level of 350 mA. The replacement of FR4 with diamond thus effectively improves the thermal management of LEDs and corresponding driver circuits.eng
dc.description.sponsorshipThe authors would like to thank Adam group for encouragement and support provide during the tenure of the present work. J.C. Mendes acknowledges the FCT for POPH post-doctoral grant SFRH/BPD/90306/2012, co-financed by European (FSE) and national (MCTES funds).
dc.identifier.citationS. Kyatam, P. Camacho, L. Rodrigues, L. N. Alves, J. C. Mendes and M. C. Figueiredo, "Thermal analysis of high power LEDs using different PCB materials," 2017 European Conference on Circuit Theory and Design (ECCTD), Catania, Italy, 2017, pp. 1-4, doi: 10.1109/ECCTD.2017.8093259
dc.identifier.doi10.1109/ecctd.2017.8093259
dc.identifier.urihttp://hdl.handle.net/10400.8/13151
dc.language.isoeng
dc.peerreviewedn/a
dc.publisherIEEE
dc.relationSFRH/BPD/90306/2012
dc.relation.ispartof2017 European Conference on Circuit Theory and Design (ECCTD)
dc.rights.uriN/A
dc.subjectThermal Management
dc.subjectJunction Temperature
dc.subjectVisible Light Communication
dc.subjectLight Emitting diodes
dc.subjectDiamond
dc.titleThermal analysis of high power LEDs using different PCB materialseng
dc.typeconference paper
dspace.entity.typePublication
oaire.citation.conferenceDate2017-09-04
oaire.citation.conferencePlaceCatania, Italy
oaire.citation.title2017 European Conference on Circuit Theory and Design (ECCTD)
oaire.versionhttp://purl.org/coar/version/c_970fb48d4fbd8a85

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